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BALL GRID ARRAY SOCKETS
1.27 mm GRID / INTERCONNECT PIN / SOLDER TAIL / SURFACE MOUNT
Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body size
and layout numbers as indicated on page 168.
For example a 20x20 pin configuration with 256 contacts as shown
on page 168 becomes 550-10-256M20-001152.
167
PGA / BGA / PLCC SOCKETS
Ball grid array interconnect pin, through hole solder tail and surface mount.
TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSULATOR Glass-epoxy laminate FR4
FLAMMABILITY UL 94V-O
CONTACT Brass CuZn36Pb3 (C36000)
MECHANICAL LIFE Min. 100 cycles
RATED CURRENT 1 A
CONTACT RESISTANCE Max. 10 m
DIELECTRIC STRENGTH Min. 500 VRMS
ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PLATING CODE TERMINATION CONNECTING PIN
10 0.25 μm gold 0.25 μm gold
DIMENSIONS
Calculate with n1 = number of contacts in one line
A = (n1x1.27)+3.27
B = (n1-1)x1.27
550-10-NNNMXX-XXX152
BGA interconnect sockets 1.27 mm grid, through hole solder tails
and connecting pin Ø 0.40 mm.
558-10-NNNMXX-XXX104
BGA interconnect sockets 1.27 mm grid, with surface mount terminations
and connecting pin Ø 0.41 mm.
Due to technical progress, all information provided is subject to change without prior notice.