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BALL GRID ARRAY SOCKETS
1 mm GRID / SURFACE MOUNT SOCKET, ADAPTER / INTERCONNECT PIN
Other plating on request (see page 178 for plating specs).
Please consult for complete part number and available footprints.
169
PGA / BGA / PLCC SOCKETS
Ball grid array sockets and adapter surface mount.
TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSULATOR Glass-epoxy laminate FR4
FLAMMABILITY UL 94V-O
SLEEVE / PIN Brass CuZn36Pb3 (C36000)
CONTACT CLIP (3 FINGER) Beryllium copper (C17200)
ACCEPTED PIN Ø 0.20 to 0.30 mm
FORCES 0.4 N typ. insertion 0.2 N typ. withdrawal
(polished steel gauge Ø 0.25 mm)
MECHANICAL LIFE Min. 100 cycles
RATED CURRENT 1 A
CONTACT RESISTANCE Max. 10 m
DIELECTRIC STRENGTH Min. 500 VRMS
ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PLATING CODE SLEEVE CLIP
11 (Serie 514) 0.25 μm gold 0.25 μm gold
PP PLATING CODE TERMINATION CONNECTING PIN
10 (Serie 558) 0.25 μm gold 0.25 μm gold
DIMENSIONS
Calculate with n1 = number of contacts in one line
A = n1+2.81
B = n1-1
514-11-NNNPXX-XXX159
BGA sockets 1 mm grid, surface mount.
Same foot print as the BGA device to mate with the corresponding
adapter.
Options: please consult for availability
- Through hole adapter.
558-10-NNNPXX-XXX102
BGA adapter 1 mm grid, pluggable into the corresponding socket.
Connecting pin Ø 0.25 mm.
BGA device is SMD soldered on the solder pads.
558-10-NNNPXX-XXX103
BGA interconnect sockets 1 mm grid with surface mount terminations
and connecting pin Ø 0.25 mm.
Due to technical progress, all information provided is subject to change without prior notice.