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PGA / BGA / PLCC - Sockets

Series 514
514-PP-NNNMXX-XXX148

BGA
1.27 mm grid socket, Surface mount

Ball grid array sockets, surface mount.

Technical specs.:

Insulator: Glass-epoxy laminate FR4
Flammability: UL 94V-0
Sleeve: Brass CuZn36Pb3 (C36000)
Contact: Beryllium copper (C17200)
Accepted pin Ø: 0.36 to 0.46 mm
Insertion force: 0.3 N typ.
Withdrawal force: 0.15 N typ.
(polished steel gauge Ø 0.43 mm)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 500 V RMS
1.27 mm grid socket, Surface mount
1.27 mm grid socket, Surface mount

Ordering information RoHS-compliant parts

 PP Plating code SleeveClip 
87 Tin Gold flash
83 Tin Gold 0.75 µm

Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 20x20 pin configuration with 256 contacts as shown here becomes 514-83-256M20-001148.
General technical specs. View CAD
514-PP-NNNMXX-XXX148

514-PP-NNNMXX-XXX148

BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.
Same foot print as the BGA device,to mate with the corresponding adapter.

514-PP-NNNMXX-XXX148

514-PP-NNNMXX-XXX148

BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.
Same foot print as the BGA device,to mate with the corresponding adapter.

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