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PGA / BGA / PLCC - Sockets

Series 546
546-PP-NNN-XX-XXX136

PGA
Solderless compliant press-fit

Pin grid array sockets, with compliant press-fit terminations.

Technical specs.:

Insulator: Black glass filled polyester PCT-GF30-FR
Flammability: UL 94V-O
Sleeve: Bronze CuSn4Pb4Zn4 (C54400)
Contact: Beryllium copper (C17200)
Accepted pin Ø: 0.40 to 0.56 mm
Insertion force: 0.7 N typ.
Withdrawal force: 0.4 N typ.
(polished steel gauge Ø 0.46 mm)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 1000 V RMS
Solderless compliant press-fit
Solderless compliant press-fit

Ordering information RoHS-compliant parts

 PP Plating code SleeveClip 
 87 Tin Gold flash
 83 Tin Gold 0.75 µm

Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 17x17 pin configuration with window and 168contacts as shown here becomes 546-83-168-17-101136.
General technical specs. View CAD
546-PP-NNN-XX-XXX136

546-PP-NNN-XX-XXX136

PGA sockets with solderless compliant press-fit terminations for 1.5 to 2.0 mm PCB thickness.
Hole diameter 1 (+0.09/-0.06) mm after metallization (Drill diameter 1.15±0.025 mm).

546-PP-NNN-XX-XXX136

546-PP-NNN-XX-XXX136

PGA sockets with solderless compliant press-fit terminations for 1.5 to 2.0 mm PCB thickness.
Hole diameter 1 (+0.09/-0.06) mm after metallization (Drill diameter 1.15±0.025 mm).

546-PP-NNN-XX-XXX135

546-PP-NNN-XX-XXX135

PGA sockets with solderless compliant press-fit terminations for 2.1 to 3.2 mm PCB thickness.
Hole diameter 1 (+0.09/-0.06) mm after metallization (Drill diameter 1.15±0.025 mm).

546-PP-NNN-XX-XXX135

546-PP-NNN-XX-XXX135

PGA sockets with solderless compliant press-fit terminations for 2.1 to 3.2 mm PCB thickness.
Hole diameter 1 (+0.09/-0.06) mm after metallization (Drill diameter 1.15±0.025 mm).