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PGA / BGA / PLCC - Sockets

Series 546
546-PP-NNN-XX-XXX147

PGA
Interstitial socket, Solderless compliant press-fit

Pin grid array sockets with interstitial contact rows, solderless compliant pins.

Technical specs.:

Insulator: Black glass filled polyester PCT-GF30-FR
Flammability: UL 94V-O
Sleeve: Bronze CuSn4Pb4Zn4 (C54400)
Contact: Beryllium copper (C17200)
Accepted pin Ø: 0.40 to 0.56 mm
Insertion force: 0.4 N typ.
Withdrawal force: 0.2 N typ.
(polished steel gauge Ø 0.46 mm)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 700 V RMS
Interstitial socket, Solderless compliant press-fit
Interstitial socket, Solderless compliant press-fit

Ordering information RoHS-compliant parts

 PP Plating code SleeveClip 
 87 Tin Gold flash
 83 Tin Gold 0.75 µm

Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 19x19 pin configuration with window and 296 contacts as shown here becomes 517-83-296-19-131111.
General technical specs. View CAD
546-PP-NNN-XX-XXX147

546-PP-NNN-XX-XXX147

Interstitial PGA sockets with solderless compliant press-fit terminations for 1.2 to 2.5 mm PCB thickness.

Hole diameter 0.7 (+0.07/-0.05) mm after metallization (Drill diameter 0.85±0.025 mm).

546-PP-NNN-XX-XXX147

546-PP-NNN-XX-XXX147

Interstitial PGA sockets with solderless compliant press-fit terminations for 1.2 to 2.5 mm PCB thickness.

Hole diameter 0.7 (+0.07/-0.05) mm after metallization (Drill diameter 0.85±0.025 mm).

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