PRECI-DIP SA


Spring-Loaded Connectors / Pogo pin connectors

 

SLC connectors, PAD connectors


PCB Connectors

Socket connectors, Pin connectors
Square Pin connectors, Headers
Jumpers


DIL / SIL / TO Sockets

DIL Sockets, DIL Headers
SIL Sockets, TO  Sockets

Contacts

Contacts

Sockets Contacts, Pin Contacts


For more information or to request assistance, please contact sales@precidip.com

« Back to search results

Your selected product

PGA / BGA / PLCC - Sockets

Series 558
558-10-NNNMXX-XXX101

PGA
1.27 mm grid, Interconnect pin solder tail

Micro pin grid array sockets (µPGA), with contacts placed on 1.27 mm grid, interconnect pin.

Technical specs.:

Insulator: Glass-epoxy laminate FR4
Flammability: UL 94V-O
Pin: Brass CuZn36Pb3 (C36000)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 500 V RMS
1.27 mm grid, Interconnect pin solder tail
1.27 mm grid, Interconnect pin solder tail

Ordering information RoHS-compliant parts

PP Plating codeTermination  Connecting pin
 10 Gold 0.25 µm Gold 0.25 µm

Replace NNN with the number of poles and XX-XXX
with body size and layout numbers as indicated here.
For example a 26x26 pin configuration with window
and 478 contacts as shown here becomes
518-77-478M26-131105.

Options: please consult for availability.
- µPGA interconnect headers for SMD mount.
General technical specs. View CAD
558-10-NNNMXX-XXX101

558-10-NNNMXX-XXX101

µPGA 1.27 mm grid, interconnect sockets with through hole solder tail and connecting pin Ø 0.31 mm.

558-10-NNNMXX-XXX101

558-10-NNNMXX-XXX101

µPGA 1.27 mm grid, interconnect sockets with through hole solder tail and connecting pin Ø 0.31 mm.