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PGA / BGA / PLCC - Sockets

Series 558
558-10-NNNMXX-XXX104

BGA
1.27 mm grid, Interconnect pin surface mount

Interconnect pin, surface mount.

Technical specs.:

Insulator: Glass-epoxy laminate FR4
Flammability: UL 94V-O
Pin: Brass CuZn36Pb3 (C36000)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 500 V RMS
1.27 mm grid, Interconnect pin surface mount
1.27 mm grid, Interconnect pin surface mount

Ordering information RoHS-compliant parts

 PP Plating code TerminationConnecting pin 
10 Gold 0.25 µm Gold 0.25 µm
   

Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 20x20 pin configuration with 256 contacts
as shown here becomes 550-10-256M20-001152.
General technical specs. View CAD
558-10-NNNMXX-XXX104

558-10-NNNMXX-XXX104

BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pinØ 0.41 mm.

558-10-NNNMXX-XXX104

558-10-NNNMXX-XXX104

BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pinØ 0.41 mm.

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