PRECI-DIP SA


Spring-Loaded Connectors / Pogo pin connectors

 

SLC connectors, PAD connectors


PCB Connectors

Socket connectors, Pin connectors
Square Pin connectors, Headers
Jumpers


DIL / SIL / TO Sockets

DIL Sockets, DIL Headers
SIL Sockets, TO  Sockets

Contacts

Contacts

Sockets Contacts, Pin Contacts


For more information or to request assistance, please contact sales@precidip.com

« Back to search results

Your selected product

PGA / BGA / PLCC - Sockets

Series 558
558-10-NNNMXX-XXX104

BGA
1.27 mm grid, Interconnect pin surface mount

Interconnect pin, surface mount.

Technical specs.:

Insulator: Glass-epoxy laminate FR4
Flammability: UL 94V-O
Pin: Brass CuZn36Pb3 (C36000)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 500 V RMS
1.27 mm grid, Interconnect pin surface mount
1.27 mm grid, Interconnect pin surface mount

Ordering information RoHS-compliant parts

 PP Plating code TerminationConnecting pin 
10 Gold 0.25 µm Gold 0.25 µm
   

Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 20x20 pin configuration with 256 contacts
as shown here becomes 550-10-256M20-001152.
General technical specs. View CAD
558-10-NNNMXX-XXX104

558-10-NNNMXX-XXX104

BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pinØ 0.41 mm.

558-10-NNNMXX-XXX104

558-10-NNNMXX-XXX104

BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pinØ 0.41 mm.