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PGA / BGA / PLCC - Sockets

Series 558
558-10-NNNPXX-XXX102

BGA
1 mm grid, BGA pin-adapter SMD

Ball grid array adapter surface mount.

Technical specs.:

Insulator: Glass-epoxy laminate FR4
New attribute: UL 94V-O
Pin: Brass CuZn36Pb3 (C36000)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 500 V RMS
1 mm grid, BGA pin-adapter SMD
1 mm grid, BGA pin-adapter SMD

Ordering information RoHS-compliant parts

 PP Plating code Termination Connecting pin
10 Gold 0.25 µm  Gold 0.25 µm
   

Other plating on request.

Please consult for complete part number and available footprints.

Options:
please consult for availability.
- Through hole adapter.

General technical specs. View CAD
558-10-NNNPXX-XXX102

558-10-NNNPXX-XXX102

BGA adapter 1 mm grid pluggable into the corresponding socket.
Connecting pin Ø 0.25 mm.
BGA device is SMD soldered on the solder pads.

558-10-NNNPXX-XXX102

558-10-NNNPXX-XXX102

BGA adapter 1 mm grid pluggable into the corresponding socket.
Connecting pin Ø 0.25 mm.
BGA device is SMD soldered on the solder pads.

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