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PGA / BGA / PLCC - Sockets

Series 558
558-10-NNNPXX-XXX103

BGA
1 mm grid, Interconnect pin surface mount

Ball grid array interconnect sockets surface mount.

Technical specs.:

Insulator: Glass-epoxy laminate FR4
Flammability: UL 94V-O
Pin: Brass CuZn36Pb3 (C36000)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 500 V RMS
1 mm grid, Interconnect pin surface mount
1 mm grid, Interconnect pin surface mount

Ordering information RoHS-compliant parts

 PP Plating code  TerminationConnecting pin
10 Gold 0.25 µm Gold 0.25 µm
   

Other plating on request.

Please consult for complete part number and available footprints.

Options: please consult for availability.
- Through hole interconnect.

General technical specs. View CAD
558-10-NNNPXX-XXX103

558-10-NNNPXX-XXX103

BGA interconnect sockets 1 mm grid with surface mount terminations and connecting pin Ø 0.25 mm.

558-10-NNNPXX-XXX103

558-10-NNNPXX-XXX103

BGA interconnect sockets 1 mm grid with surface mount terminations and connecting pin Ø 0.25 mm.