PGA / BGA / PLCC - Sockets
BGA
1.27 mm grid socket, Surface mount
Ball grid array sockets, surface mount.
Technical specs.:
Insulator: |
Glass-epoxy laminate FR4 |
---|---|
Flammability: |
UL 94V-0 |
Sleeve: |
Brass CuZn36Pb3 (C36000) |
Contact: |
Beryllium copper (C17200) |
Accepted pin Ø: |
0.36 to 0.46 mm |
Insertion force: |
0.3 N typ. |
Withdrawal force: |
0.15 N typ. (polished steel gauge Ø 0.43 mm) |
Mechanical life: |
Min. 100 cycles |
Rated current: |
1 A |
Contact resistance: |
Max. 10 mΩ |
Dielectric strength: |
Min. 500 V RMS |
Ordering information RoHS-compliant parts
PP Plating code | Sleeve | Clip |
87 | Tin | Gold flash |
83 | Tin | Gold 0.75 µm |
Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 20x20 pin configuration with 256 contacts as shown here becomes 514-83-256M20-001148.
514-PP-NNNMXX-XXX148
BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.
Same foot print as the BGA device,to mate with the corresponding adapter.
514-PP-NNNMXX-XXX148
BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.
Same foot print as the BGA device,to mate with the corresponding adapter.