PGA / BGA / PLCC - Sockets
Series 558
558-10-NNNMXX-XXX101
PGA
1.27 mm grid, Interconnect pin solder tail
Micro pin grid array sockets (µPGA), with contacts placed on 1.27 mm grid, interconnect pin.
Technical specs.:
| Insulator: |
Glass-epoxy laminate FR4 |
|---|---|
| Flammability: |
UL 94V-O |
| Pin: |
Brass CuZn36Pb3 (C36000) |
| Mechanical life: |
Min. 100 cycles |
| Rated current: |
1 A |
| Contact resistance: |
Max. 10 mΩ |
| Dielectric strength: |
Min. 500 V RMS |
Ordering information RoHS-compliant parts
| PP Plating code | Termination | Connecting pin |
| 10 | Gold 0.25 µm | Gold 0.25 µm |
Replace NNN with the number of poles and XX-XXX
with body size and layout numbers as indicated here.
For example a 26x26 pin configuration with window
and 478 contacts as shown here becomes
518-77-478M26-131105.
Options: please consult for availability.
- µPGA interconnect headers for SMD mount.
558-10-NNNMXX-XXX101
µPGA 1.27 mm grid, interconnect sockets with through hole solder tail and connecting pin Ø 0.31 mm.
558-10-NNNMXX-XXX101
µPGA 1.27 mm grid, interconnect sockets with through hole solder tail and connecting pin Ø 0.31 mm.