Ball grid array sockets and adapters, surface mount.
TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSULATOR Glass-epoxy laminate FR4
FLAMMABILITY UL 94V-O
SLEEVE / PIN Brass CuZn36Pb3 (C36000)
CONTACT CLIP (4 FINGER) Beryllium copper (C17200)
ACCEPTED PIN Ø 0.36 to 0.46 mm
FORCES 0.3 N typ. insertion 0.15 N typ. withdrawal
(polished steel gauge Ø 0.43 mm)
MECHANICAL LIFE Min. 100 cycles
RATED CURRENT 1 A
CONTACT RESISTANCE Max. 10 m
DIELECTRIC STRENGTH Min. 500 VRMS
ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PLATING CODE SLEEVE CLIP
87 (Serie 514) Tin Flash gold
83 (Serie 514) Tin 0.75 μm gold
PP PLATING CODE TERMINATION CONNECTING PIN
10 (Serie 550) 0.25 μm gold 0.25 μm gold
80 (Serie 550) Tin Tin
Calculate with n1 = number of contacts in one line
A = (n1x1.27)+1.27
B = (n1-1)x1.27
A = (n1x1.27)+3.27
B = (n1-1)x1.27
BALL GRID ARRAY SOCKETS
1.27 mm GRID / SURFACE MOUNT / SOCKET AND ADAPTER
BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.
Same foot print as the BGA device, to mate with the corresponding adapter.
BGA adapter 1.27 mm grid pluggable into the corresponding socket.
Connecting pin Ø 0.42 mm.
BGA device is SMD soldered on the solder pads.
BGA socket and adapter systems are the reliable solution to make BGAs pluggable:
- the BGA socket Series 514 ➀ is soldered to the PCB in place of the BGA device
and using the same footprint
- the BGA device ➂ is soldered to the adapter Series 550 ➁
- the BGA + adapter sub-assembly is plugged into the socket
Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body size
and layout numbers as indicated on page 168.
For example a 20x20 pin configuration with 256 contacts as shown
on page 168 becomes 514-83-256M20-001148.
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Due to technical progress, all information provided is subject to change without prior notice.