PGA / BGA / PLCC - Sockets
Series 514
514-11-NNNPXX-XXX159
BGA
1mm grid, Surface mount
Ball grid array sockets surface mount.
Technical specs.:
| Insulator: |
Glass-epoxy laminate FR4 |
|---|---|
| Flammability: |
UL 94V-0 |
| Sleeve: |
Brass CuZn36Pb3 (C36000) |
| Contact: |
Beryllium copper (C17200) |
| Accepted pin Ø: |
0.20 to 0.30 mm |
| Insertion force: |
0.4 N typ. |
| Withdrawal force: |
0.2 N typ. (polished steel gauge Ø 0.25 mm) |
| Mechanical life: |
Min. 100 cycles |
| Rated current: |
1 A |
| Contact resistance: |
Max. 10mΩ |
| Dielectric strength: |
Min. 500 V RMS |
Ordering information RoHS-compliant parts
| PP Plating code | Sleeve | Clip |
| 11 | Gold 0.25 µm | Gold 0.25 µm |
Other plating on request.
Please consult for complete part number and available footprints.
514-11-NNNPXX-XXX159
BGA sockets 1 mm grid surface mount.
Same foot print as the BGA device to mate with the corresponding adapter.
514-11-NNNPXX-XXX159
BGA sockets 1 mm grid surface mount.
Same foot print as the BGA device to mate with the corresponding adapter.