Spring-Loaded Connectors / Pogo pin connectors

Spring-Loaded Connectors / Pogo pin connectors


SLC products, PAD products



Sockets Contacts, Pin Contacts



PCB Connectors

PCB Connectors

Socket connectors, Pin connectors
Square Pin connectors, Headers

DIL / SIL / TO Sockets

DIL Sockets, DIL Headers
SIL Sockets, TO  Sockets

General specifications - PCB connectors

The values listed below are general specs applying for preci-dip socket and pin connectors. Please see individual catalog page for additional and product specific technical data.

Operating temperature range: -55 ... +125 °C
Climatic category (IEC): 55/125/21
Operating humidity range: annual mean 75 %
Max working voltage: 100 VRMS/150 VDC (2.54 mm grid)

PRECI-DIP products are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal, Control and Power Applications", File Nr. E174442.

mechanical characteristics

Clip retention                                           Min. 40 N (no displacement under axial force applied)

Contact (sleeve / clip) retention            Min. 3.3 N acc. to MIL-DTL-83734, pt

Electrical characteristics

Insulation resistance between any two adjacent contacts           Min. 10'000 MΩ at 500 V AC
Capacitance between any two adjacent contacts                           Max. 1 pF

Air and creepage distances between any two adjacent contacts
SERIES                3xx/4xx/7xx              80x                      83x                      85x                          86x
mm                       0.7                           0.85 / 0.7           0.5                       0.4 / 0.5                  0.5

Environmental characteristics

The sockets withstand the following environmental tests without mechanical and electrical defects:

  • Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h
  • Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h
  • Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
  • Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min
  • Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis
  • Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis

During the above two tests no contact interruption >50 ns does appear.

  • Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7
  • Resistance to soldering heat J-STD-0020C, 260°C, 20 s
  • Resistance to corrosion:
         Salt spray test IEC 60068-2-11.Ka: 48 h
         Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH
         Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH

Solderless compliant Press-Fit characteristics

Press-fit characteristics measured acc. to IEC 60352-5

Press-in force:          90 N max. (at min. hole dia.) / 65 N typ.
Push-out force:         30 N min. (at max. hole dia.) / 50 N typ.
Push-out 3rd cycle:  20 N min. (at max. hole dia.)

PCB Hole Dimensions

2 mm grid                   Finished hole Ø: 0.7 + 0.09/-0.06 mm
                                      Drilled hole Ø: 0.8 ± 0.02 mm 

2.54 mm grid              Finished hole Ø: 1 + 0.09/-0.06 mm
                                      Drilled hole Ø: 1.15 ± 0.02 mm 

PCB Hole Plating

PCB surface finish                          Hole plating
Tin                                                      5-15 µm tin over min. 25 µm copper
Copper                                              min. 25 µm copper
Gold over nickel                               0.05-0.2 µm gold over 2.5-5 µm nickel
                                                            over min. 25 µm copper


  • Standard connector packaging is card box.
  • SMD mount connectors available on request with Tape & Reel packaging acc. to EIA Standard 481
This website is using cookies for statistics, site optimization and retargeting purposes. You consent to our cookies if you continue to use this website. Read more here.