PGA / BGA / PLCC - Sockets
BGA
1.27 mm grid, Interconnect pin solder tail
Interconnect pin, through hole solder tail
Technical specs.:
Insulator: |
Glass-epoxy laminate FR4 |
---|---|
Flammability: |
UL 94V-O |
Pin: |
Brass CuZn36Pb3 (C36000) |
Mechanical life: |
Min. 100 cycles |
Rated current: |
1 A |
Contact resistance: |
Max. 10 mΩ |
Dielectric strength: |
Min. 500 V RMS |
![](/data/images/catalog/gifPGA/pag_137a.gif)
![1.27 mm grid, Interconnect pin solder tail](/data/images/catalog/gifPGA/pag_137b.gif)
![1.27 mm grid, Interconnect pin solder tail](/data/images/catalog/jpgPGA_BGA_PLCC/tif_137.jpg)
Ordering information RoHS-compliant parts
PP Plating code | Termination | Connecting pin |
10 | Gold 0.25 µm | Gold 0.25 µm |
Replace NNN with the number of poles and XX-XXX
with body size and layout numbers as indicated here.
For example a 20x20 pin configuration with 256
contacts as shown here becomes
550-10-256M20-001152.
![550-10-NNNMXX-XXX152](/Htdocs/Images/lib/empty.gif)
550-10-NNNMXX-XXX152
BGA interconnect sockets 1.27 mm grid, through hole solder tails and connecting pin Ø 0.40 mm
![550-10-NNNMXX-XXX152](/Htdocs/Images/lib/empty.gif)
550-10-NNNMXX-XXX152
BGA interconnect sockets 1.27 mm grid, through hole solder tails and connecting pin Ø 0.40 mm.