PRECI-DIP SA

Spring-Loaded Connectors / Pogo pin connectors

Spring-Loaded Connectors / Pogo pin connectors

 

SLC products, PAD products

PCB Connectors

PCB Connectors

Socket connectors, Pin connectors
Square Pin connectors, Headers
Jumpers


DIL / SIL / TO Sockets

DIL Sockets, DIL Headers
SIL Sockets, TO  Sockets

Contacts

Contacts

Sockets Contacts, Pin Contacts

Series 0900-CLIP

Series 0900-CLIP

High Reliability Spring Loaded Contact with CLIP Design

Series-0900

Series-0900

Spring Loaded Contact with berrylium copper spring


For more information or to request assistance, please contact sales@precidip.com

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PGA / BGA / PLCC - Sockets

Series 550
550-10-NNNMXX-XXX166

BGA
1.27 mm grid, BGA pin-adapter, SMD

Ball grid array adapters, surface mount.

Technical specs.:

Insulator: Glass-epoxy laminate FR4
New attribute: UL 94V-O
Pin: Brass CuZn36Pb3 (C36000)
Mechanical life: Min. 100 cycles
Rated current: 1 A
Contact resistance: Max. 10 mΩ
Dielectric strength: Min. 500 V RMS
1.27 mm grid, BGA pin-adapter, SMD
1.27 mm grid, BGA pin-adapter, SMD

Ordering information RoHS-compliant parts

 PP Plating code Termination Connecting pin
10Gold 0.25 µm Gold 0.25 µm
   

Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 20x20 pin configuration with 256 contacts
as shown here becomes 514-83-256M20-001148.
General technical specs. View CAD
550-10-NNNMXX-XXX166

550-10-NNNMXX-XXX166

BGA adapter 1.27 mm grid pluggable into the corresponding socket.
Connecting pin Ø 0.42 mm.BGA device is SMD soldered on the solder pads.

550-10-NNNMXX-XXX166

550-10-NNNMXX-XXX166

BGA adapter 1.27 mm grid pluggable into the corresponding socket.
Connecting pin Ø 0.42 mm.BGA device is SMD soldered on the solder pads.

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