PGA / BGA / PLCC - Sockets
Series 558
558-10-NNNPXX-XXX103
BGA
1 mm grid, Interconnect pin surface mount
Ball grid array interconnect sockets surface mount.
Technical specs.:
| Insulator: |
Glass-epoxy laminate FR4 |
|---|---|
| Flammability: |
UL 94V-O |
| Pin: |
Brass CuZn36Pb3 (C36000) |
| Mechanical life: |
Min. 100 cycles |
| Rated current: |
1 A |
| Contact resistance: |
Max. 10 mΩ |
| Dielectric strength: |
Min. 500 V RMS |
Ordering information RoHS-compliant parts
| PP Plating code | Termination | Connecting pin |
| 10 | Gold 0.25 µm | Gold 0.25 µm |
Other plating on request.
Please consult for complete part number and available footprints.
Options: please consult for availability.
- Through hole interconnect.
558-10-NNNPXX-XXX103
BGA interconnect sockets 1 mm grid with surface mount terminations and connecting pin Ø 0.25 mm.
558-10-NNNPXX-XXX103
BGA interconnect sockets 1 mm grid with surface mount terminations and connecting pin Ø 0.25 mm.