PGA / BGA / PLCC - Sockets
Series 558
558-10-NNNMXX-XXX104
BGA
1.27 mm grid, Interconnect pin surface mount
Interconnect pin, surface mount.
Technical specs.:
| Insulator: |
Glass-epoxy laminate FR4 |
|---|---|
| Flammability: |
UL 94V-O |
| Pin: |
Brass CuZn36Pb3 (C36000) |
| Mechanical life: |
Min. 100 cycles |
| Rated current: |
1 A |
| Contact resistance: |
Max. 10 mΩ |
| Dielectric strength: |
Min. 500 V RMS |
Ordering information RoHS-compliant parts
| PP Plating code | Termination | Connecting pin |
| 10 | Gold 0.25 µm | Gold 0.25 µm |
Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here.
For example a 20x20 pin configuration with 256 contacts
as shown here becomes 550-10-256M20-001152.
558-10-NNNMXX-XXX104
BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pinØ 0.41 mm.
558-10-NNNMXX-XXX104
BGA interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pinØ 0.41 mm.